Call for Speakers: Packaging & Branding at HOW Design Live 2016
by Andrew Gibbs on 11/09/2015 | 1 Minute Read
Over the past 5 years, The Dieline has had the pleasure of collaborating with some of the greatest minds and most talented designers and leaders in the design industry through The Dieline Packaging & Branding at HOW Design Live.
Are you interested in speaking for us? We want to hear from you!
The Dieline Packaging & Branding Conference at HOW Design Live Atlanta, May 19-23
Potential Topics: Packaging Design, Branding, Structural Design, Consumer Brands, Consumer Product Branding, Consumer Trends, Packaging Materials & Substrates, Best Practices, The Future of Package Design.